Recklinghausen, Germany

Nicolai Kolb

This inventor holds 7 USPTO granted patents and 2 published patent applications and 4 EPO patents. Top assignees: Evonik Operations Gmbh, Evonik Degussa Gmbh. Active years: 2019-2026.

USPTO Granted Patents = 7 

% Patents Active = 57.1

 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2019-2026

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7 patents (USPTO):Explore Patents

Title: Nicolai Kolb: Innovator in Adhesive Technologies

Introduction

Nicolai Kolb is a notable inventor based in Recklinghausen, Germany. He has made significant contributions to the field of adhesive technologies, holding a total of 7 patents. His work focuses on innovative processes and compositions that enhance bonding techniques.

Latest Patents

Kolb's latest patents include a process for bonding substrates, which allows for a bond that can be released by heat treatment at temperatures ranging from 50° C. to less than 200° C. This invention utilizes a specific polymer composition that avoids components derived from (meth)acrylic acid units. Another significant patent involves reactive adhesives based on block copolymers, which includes a unique composition that features a reaction product of an unhydrogenated polyolefin and cyclic esters, along with titanium content for improved bonding capabilities.

Career Highlights

Throughout his career, Nicolai Kolb has worked with prominent companies such as Evonik Operations GmbH and Evonik Degussa GmbH. His experience in these organizations has allowed him to develop and refine his innovative approaches to adhesive technologies.

Collaborations

Kolb has collaborated with notable colleagues, including Gabriele Brenner and Bernhard Schleimer. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Nicolai Kolb's contributions to adhesive technologies through his patents and collaborations highlight his role as an influential inventor in the field. His innovative processes continue to shape the future of bonding techniques.

Profile summary based on public USPTO records.
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