The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Oct. 11, 2019
Evonik Operations Gmbh, Essen, DE;
Evonik Operations GmbH, Essen, DE;
Abstract
The present invention relates to a process for bonding substrates, wherein the bond is a bond that can be released by heat treatment at a temperature of 50° C. to less than 200° C. and a composition is used to produce the bond, said composition containing a polymer of formula (I): Q-(O—C(O)—CR′R″—C(O)—R), where: Q=a polymer group, selected from a polyester group and/or a polyolefin group, wherein the polymer group does not contain any components that result from the use of molecules having (meth)acrylic acid units as monomers; x is greater than or equal to 1; R═Ror O—R; R2=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms; R3=a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a polymer group; R′=—H, or a hydrocarbon group, which can be substituted with halogen atoms, comprising 1 to 10 carbon atoms, or a group of formula (II): —C(O)—NH-Q′, where Q′=an organic group which can also have one or more silicon atoms; and R″=—H or a group of formula (II), with the proviso that if neither of the groups R′ and R″ is a group of formula (II), then at least one of the groups R′ or R″ is —H.