Santa Monica, CA, United States of America

Nicholas Lavada Nemeth


Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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6 patents (USPTO):

Title: The Innovative Contributions of Nicholas Lavada Nemeth

Introduction

Nicholas Lavada Nemeth is a prominent inventor based in Santa Monica, California. He has made significant contributions to the field of material bonding, holding a total of six patents. His innovative work focuses on systems and techniques that enhance the bonding of laminate materials and membranes.

Latest Patents

One of Nemeth's latest patents involves laminate material bonding. This patent describes a method where a bonding agent is applied to a first layer, followed by placing a second layer onto the bonding agent to form a laminate material. The laminate material is then positioned between non-compliant and compliant materials, with pressure applied to ensure proper curing of the bonding agent. Another notable patent is related to membrane bonding with photoresist. In this invention, a photoresist is applied to an ultrasonic device, and a bonding agent is used to secure a membrane in contact with the device. This innovative approach allows for effective bonding under controlled pressure conditions.

Career Highlights

Nemeth's career is marked by his dedication to advancing material bonding technologies. His work at Ubeam Inc. has positioned him as a key player in the industry, where he continues to develop cutting-edge solutions. His patents reflect a deep understanding of the complexities involved in material interactions and bonding processes.

Collaborations

Throughout his career, Nemeth has collaborated with talented individuals such as Andrew W. Joyce and Sean Taffler. These partnerships have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Nicholas Lavada Nemeth's contributions to the field of material bonding are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of bonding technologies.

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