The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Mar. 08, 2016
Applicant:

Ubeam Inc., Santa Monica, CA (US);

Inventors:

Nicholas Lavada Nemeth, Santa Monica, CA (US);

Adam Stephen Elhadad, Santa Monica, CA (US);

Andrew Joyce, Venice, CA (US);

Sean Taffler, Pacific Palisades, CA (US);

Assignee:

uBeam Inc., Marina del Rey, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/40 (2006.01); B23K 26/06 (2014.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 26/364 (2014.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0026 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B23K 2203/172 (2015.10); H05K 3/0052 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0346 (2013.01); H05K 2203/107 (2013.01);
Abstract

Systems and techniques are provided for trench cutting with laser machining. A laminate material including a conductive layer and a non-conductive layer may be cut with a first cut using a UV-laser. The cutting of a second cut, using the UV-laser, may be started at a top electrode of the non-conductive layer based on the location of the first cut, wherein the second cut is wider than the first cut. The cutting of the second cut may be stopped partially though the non-conductive layer. The stopping of the cutting of the second cut partially though the non-conductive layer may include stopping the cutting of the second cut before cutting a bottom electrode of the non-conductive layer.


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