Nicholas J Salatino

Title: Innovations of Nicholas J Salatino

Introduction

Nicholas J Salatino is a notable inventor based in Webster, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving methods for dicing semiconductor wafers, which is crucial for the manufacturing of electronic components.

Latest Patents

Salatino's latest patents include a method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer. The method involves cutting a reference slot in the back main surface of the wafer and determining a desired location for a chip edge. By applying radiant energy, a series of reformed regions are formed within the wafer, allowing for precise separation along these regions. Additionally, he has developed a U-groove profile as an alternative to the traditional V-groove profile for dicing, which results in cost savings and improved yield.

Career Highlights

Nicholas J Salatino is currently employed at Xerox Corporation, where he continues to innovate in the semiconductor field. His work has not only advanced the technology but has also contributed to the efficiency of manufacturing processes.

Collaborations

Salatino has collaborated with notable coworkers such as Paul Allen Hosier and John C Ackerman, further enhancing the innovative environment at Xerox Corporation.

Conclusion

Nicholas J Salatino's contributions to semiconductor technology through his patents and work at Xerox Corporation highlight his role as a significant inventor in the field. His innovative methods for dicing semiconductor wafers are paving the way for advancements in electronic manufacturing.