The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Nov. 30, 2001
Alain E. Perregaux, Rochester, NY (US);
Paul A. Hosier, Rochester, NY (US);
Josef E. Jedlicka, Rochester, NY (US);
Nicholas J. Salatino, Penfield, NY (US);
Jagdish C. Tandon, Fairport, NY (US);
Alain E. Perregaux, Rochester, NY (US);
Paul A. Hosier, Rochester, NY (US);
Josef E. Jedlicka, Rochester, NY (US);
Nicholas J. Salatino, Penfield, NY (US);
Jagdish C. Tandon, Fairport, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.