Company Filing History:
Years Active: 2022
Title: Innovations by Nicholas G Herrick in Solder Alloys
Introduction
Nicholas G Herrick is an accomplished inventor based in Edison, NJ (US). He has made significant contributions to the field of electronic interconnects through his innovative work on solder alloys. His research focuses on enhancing the electrical and thermal properties of these materials, which are crucial for modern electronics.
Latest Patents
Nicholas holds a patent for "Advanced solder alloys for electronic interconnects." This invention improves the electrical and thermal properties of solder alloys by incorporating micro-additives. These additives allow for precise engineering of the alloys' properties and the reaction layers between the solder and metal surfaces. The resulting solder alloys exhibit controlled electrical and thermal conductivity across a wide temperature range. Additionally, they maintain stable microstructures that do not significantly change when exposed to temperature variations, unlike traditional interconnect materials.
Career Highlights
Nicholas G Herrick is currently employed at Alpha Assembly Solutions Inc., where he continues to develop innovative solutions in the field of solder alloys. His work has positioned him as a key figure in advancing electronic interconnect technology.
Collaborations
Some of his notable coworkers include Morgana De Avila Ribas and Pritha Choudhury, who contribute to the collaborative environment at Alpha Assembly Solutions Inc.
Conclusion
Nicholas G Herrick's innovative work in solder alloys has the potential to significantly impact the electronics industry. His patent demonstrates a commitment to improving the performance and reliability of electronic interconnects.