The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jan. 25, 2019
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Morgana de Avila Ribas, Bangalore, IN;
Pritha Choudhury, Bangalore, IN;
Siuli Sarkar, Bangalore, IN;
Ranjit Pandher, Plainsboro, NJ (US);
Nicholas G Herrick, Edison, NJ (US);
Amit Patel, East Brunswick, NJ (US);
Ravindra M Bhatkal, East Brunswick, NJ (US);
Bawa Singh, Marlton, NJ (US);
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Abstract
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.