Company Filing History:
Years Active: 2008
Title: Ngai Kin Tsui: Innovator in Semiconductor Adhesion Technology
Introduction
Ngai Kin Tsui is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, particularly in enhancing the adhesion of molding compounds to semiconductor devices. His innovative approach has the potential to improve the reliability and performance of semiconductor applications.
Latest Patents
Ngai Kin Tsui holds a patent for a method that enhances adhesion between a molding compound and a semiconductor device. This patent, titled "Coating for enhancing adhesion of molding compound to semiconductor devices," describes a process where a polymer primer is applied to the semiconductor device before molding. The application of this coating can be achieved through various methods, including dipping, dripping, or spraying the semiconductor device with a polymer solution. He has 1 patent to his name.
Career Highlights
Ngai Kin Tsui is currently employed at ASM Assembly Automation Limited, where he continues to work on innovative solutions in the semiconductor industry. His expertise in adhesion technology has positioned him as a valuable asset to his company and the broader field of semiconductor manufacturing.
Collaborations
Throughout his career, Ngai Kin Tsui has collaborated with talented individuals such as Jianxiong Li and Chi Chuen Chaw. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Ngai Kin Tsui's contributions to semiconductor adhesion technology exemplify the importance of innovation in enhancing device performance. His work not only advances the field but also sets a foundation for future developments in semiconductor manufacturing.