The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Dec. 22, 2004
Jianxiong LI, Hong Kong, CN;
Chi Chuen Chaw, Hong Kong, CN;
Ngai Kin Tsui, Hong Kong, CN;
Deming Liu, Hong Kong, CN;
Yiu Fai Kwan, Hong Kong, CN;
Wai Chan, Hong Kong, CN;
Jianxiong Li, Hong Kong, CN;
Chi Chuen Chaw, Hong Kong, CN;
Ngai Kin Tsui, Hong Kong, CN;
Deming Liu, Hong Kong, CN;
Yiu Fai Kwan, Hong Kong, CN;
Wai Chan, Hong Kong, CN;
ASM Assembly Automation Ltd., Hong Kong, HK;
Abstract
A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.