Company Filing History:
Years Active: 2001-2002
Title: Nelson Fan: Innovator in Leadless Integrated Circuit Packaging
Introduction
Nelson Fan is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His innovative designs focus on enhancing the efficiency and functionality of leadless plastic chip carriers.
Latest Patents
Among his latest patents is the "Leadless plastic chip carrier with etch back pad singulation." This invention involves constructing a leadless plastic chip carrier by half etching one or both sides of the package design onto a leadframe strip. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip may then be performed by saw singulation or die punching. Another notable patent is the "Exposed die leadless plastic chip carrier." This leadless integrated circuit package comprises an exposed semiconductor die and contact pads embedded in an over mold, with wires interconnecting the semiconductor die and contact pads. The fabrication process includes etching a leadframe strip to define contact pads, attaching an adhesive film, and encapsulating the assembly in molding material.
Career Highlights
Nelson Fan is currently employed at A-Sat Corporation, where he continues to innovate in the field of semiconductor packaging. His work has significantly impacted the efficiency of integrated circuit designs, making them more reliable and easier to manufacture.
Collaborations
Nelson collaborates with his coworker, Neil Mclellan, to further advance their projects and share insights in their field of expertise.
Conclusion
Nelson Fan's contributions to leadless integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.