The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Dec. 03, 1999
Nelson Fan, Sham Tseng, HK;
Neil McLellan, Branksom, HK;
Asat LTD, Tsuen Wan, HK;
Abstract
A leadless integrated circuit package, comprising an exposed semiconductor die and contact pads embedded in an over mold, and wires interconnecting the semiconductor die and contact pads. The leadless integrated circuit package is fabricated by etching a leadframe strip to define a plurality of contact pads; attaching an adhesive film to a bottom surface of the leadframe strip; mounting a semiconductor die to the adhesive film intermediate respective pairs of the contact pads; wire bonding the semiconductor die to the respective pairs of contact pads; encapsulating a top surface of the leadframe strip in a molding material; removing the adhesive film from the bottom surface of the leadframe strip for exposing the contact pads and the semiconductor die; solder plating the exposed bottom surface, and singulating the leadless integrated circuit package from the leadframe strip, whereby the adhesive film holds the semiconductor die in place prior to the encapsulating step, and prevents the molding material from contacting the exposed contact pads.