This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Innovations by Navin Kalidas in Semiconductor Packaging
Introduction
Navin Kalidas is an accomplished inventor based in Houston, TX, known for his contributions to semiconductor packaging technology. He has developed innovative solutions that enhance the performance and efficiency of semiconductor devices. His work is particularly significant in the realm of ball grid array (BGA) devices.
Latest Patents
Navin Kalidas holds a patent for a "Semiconductor package having a grid array of pin-attached balls." This invention involves a semiconductor chip mounted onto a tape substrate using attach adhesive. The design features a metal layer on the top surface of the substrate that utilizes between about 30% to 90% of its area for connecting lines, with the remainder allocated for members/rings and terminals. This configuration allows for the routing of differential pair signals and a large number of signals on a single layer tape package, creating an inexpensive high-performance tape ball grid array package for chip-scale devices. The terminals serve as connections to the chip contact pads, while the conductive pins act as anchors for the solder bodies/balls. Notably, these pins are designed to be substantially insensitive to thermomechanical stresses during assembly, testing, and operation.
Career Highlights
Navin Kalidas is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of semiconductor technology. His work has contributed to advancements in the efficiency and reliability of semiconductor devices.
Collaborations
Throughout his career, Navin has collaborated with notable colleagues, including Gregory Eric Howard and Paul Joseph Hundt. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Navin Kalidas is a prominent figure in semiconductor packaging innovation, with a focus on enhancing the performance of chip-scale devices. His contributions have made a significant impact in the industry, showcasing the importance of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile