Texas Instruments Corporation

Navin Kalidas

Gregory Eric Howard

Gary Paul Morrison

Paul Joseph Hundt

Semiconductor chip () of a ball grid array device () is mounted onto tape substrate () using attach adhesive (). The metal layer on the top surface of substrate () uses between about 30% to 90% of its area for connecting lines (), and only the remainder for members/rings () and terminals (). Routing of differential pair signals and large numbers of signals on a single layer tape package are feasible. This embodiment creates an inexpensive high performance tape ball grid array package for chip-scale devices. Terminals () serve the connection (by bonding wires or reflow bumps) to the chip contact pads. Inserted in members/rings () are the conductive pins (), which serve as anchors for the solder bodies/balls (). Pins () are substantially insensitive to the thermomechanical stresses, which occur in device () during assembly, testing and operation.

Growing community of inventors

Houston, TX, United States of America

Navin Kalidas