Jerusalem, Israel

Nathan Yehuda Klein

This inventor holds 1 USPTO granted patent. Top assignee: Stratasys, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nathan Yehuda Klein. Retrieved from https://idiyas.com/inventor/nathan-yehuda-klein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Nathan Yehuda Klein: Inventor in Additive Manufacturing

Introduction

Nathan Yehuda Klein is an inventor based in Jerusalem, Israel, and works at Stratasys, Inc. His patent work focuses on encoding data for additive manufacturing. He is credited with 1 patent.

Latest Patents

Klein’s patent, “Method and System for Encoding Data for Additive Manufacturing,” describes a way to define and store a planar pattern for use in additive manufacturing. The method presents a graphical user interface with controls for selecting a planar segment, shaping a pattern, and choosing materials. It displays a cross-section of a three-dimensional object at the selected position, then overlays a pattern of nested contours. The contours are shaped according to user input and associated with building materials selected through the interface. The resulting pattern description is stored as a data structure in computer storage.

Career Highlights

Klein’s listed professional affiliation is Stratasys, Inc., a company associated with additive manufacturing. His patent describes an interface-based approach to organizing pattern and material information for a selected cross-section of a three-dimensional object.

Collaborations

Ido Bitan and Ben Klein are identified as Klein’s coworkers. The available information does not specify their roles in the patent or any particular collaboration.

Conclusion

Nathan Yehuda Klein’s patent addresses how planar patterns, nested contours, and material selections can be encoded and stored for additive manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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