Riverside, CA, United States of America

Nasser K Budraa


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2004-2005

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2 patents (USPTO):Explore Patents

Title: Nasser K Budraa: Innovator in Microwave Bonding Technologies

Introduction

Nasser K Budraa is a prominent inventor based in Riverside, CA (US). He has made significant contributions to the field of microwave bonding technologies, holding 2 patents that showcase his innovative approaches to bonding materials.

Latest Patents

His latest patents include "Microwave Bonding of MEMS Component" and "Microwave Bonding of Thin Film Metal Coated Substrates." In the first patent, bonding of MEMS materials is carried out using microwave energy. High microwave absorbing films are placed within a microwave cavity and excited to cause selective heating in the skin of the material. This method minimizes the effects of the bonding microwave energy. The second patent describes a similar process, where bonding of materials such as MEMS is achieved using microwaves. High microwave absorbing films are again utilized within a microwave cavity containing less microwave absorbing materials, leading to selective heating in the skin depth of the films. This technique effectively minimizes unwanted heating effects during the microwave bonding process.

Career Highlights

Nasser K Budraa is affiliated with the California Institute of Technology, where he continues to advance his research and innovations in microwave bonding technologies. His work has garnered attention for its potential applications in various fields, particularly in microelectromechanical systems (MEMS).

Collaborations

He has collaborated with notable colleagues, including Martin B Barmatz and John D Mai, contributing to a dynamic research environment that fosters innovation and development.

Conclusion

Nasser K Budraa's contributions to microwave bonding technologies reflect his dedication to advancing the field of materials science. His innovative patents and collaborations position him as a key figure in the ongoing evolution of bonding techniques.

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