California Institute of Technology

Nasser K Budraa

Martin B Barmatz

Henry W Jackson

William Thomas Pike

John D Mai

Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.

Microwave bonding of MEMS component

Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films are placed within a microwave cavity containing other less microwave absorbing materials, and excited to cause selective heating in the skin depth of the films. This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.

Growing community of inventors

Riverside, CA, United States of America

Nasser K Budraa