The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Apr. 20, 2000
Applicants:
Martin B. Barmatz, La Cresenta, CA (US);
John D. Mai, Pasadena, CA (US);
Henry W. Jackson, La Verne, CA (US);
Nasser K. Budraa, Riverside, CA (US);
William T. Pike, London, GB;
Inventors:
Martin B. Barmatz, La Cresenta, CA (US);
John D. Mai, Pasadena, CA (US);
Henry W. Jackson, La Verne, CA (US);
Nasser K. Budraa, Riverside, CA (US);
William T. Pike, London, GB;
Assignee:
California Institute of Technology, Pasadena, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/30 ;
U.S. Cl.
CPC ...
Abstract
Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.