Location History:
- So. Pasadena, CA (US) (2004)
- Pasadena, CA (US) (2005)
Company Filing History:
Years Active: 2004-2005
Title: The Innovative Mind of John D. Mai
Introduction
John D. Mai is a renowned inventor based in Pasadena, California. With two patents credited to his name, his work mainly focuses on the innovative bonding techniques for MEMS (Micro-Electro-Mechanical Systems) components. His contributions to the field have greatly advanced the methods of material bonding through the use of microwave technology.
Latest Patents
John Mai's latest patents showcase his cutting-edge research in microwave bonding. His first patent, "Microwave bonding of MEMS component," details a method of bonding MEMS materials using microwave energy. High microwave absorbing films are strategically placed within a microwave cavity and excited to cause selective heating in the material's skin. This technique effectively minimizes the detrimental effects typically associated with bonding microwave energy.
The second patent, "Microwave bonding of thin film metal coated substrates," highlights a similar approach. By incorporating high microwave absorbing films within a cavity along with other less absorbing materials, the method allows for selective heating during the bonding process. This innovation reduces unwanted heating effects, ensuring a more efficient and controlled bonding of materials such as MEMS.
Career Highlights
John D. Mai is affiliated with the California Institute of Technology, an esteemed institution known for its leading-edge research and technological advancements. His work at the institute has enabled him to explore various aspects of material science and engineering, specifically focusing on the applications of microwave technology in MEMS.
Collaborations
Throughout his career, John has collaborated with fellow researchers and professionals, including Martin B. Barmatz and Henry W. Jackson. These partnerships have allowed for a richer exchange of ideas and fostered innovations in the field of microwave bonding and MEMS technology.
Conclusion
John D. Mai's contributions to the field of microwave bonding for MEMS components reflect his dedication to pushing the boundaries of engineering and material science. With significant patents to his name and collaboration with esteemed colleagues, he continues to make a noteworthy impact in the industry, paving the way for future innovations.