Location History:
- Glendale, CA (US) (1983 - 1993)
- LaCanada, CA (US) (1996)
- Pasadena, CA (US) (2000 - 2002)
- La Cresenta, CA (US) (2005)
- La Crescenta, CA (US) (1998 - 2014)
Company Filing History:
Years Active: 1983-2014
Title: Martin B Barmatz: Innovator in Dielectric Property Measurements and MEMS Technology
Introduction: Martin B Barmatz, located in Glendale, California, is an esteemed inventor with an impressive portfolio of 25 patents. His work primarily focuses on techniques related to dielectric property measurements and microwave bonding in micro-electromechanical systems (MEMS).
Latest Patents: Among his notable contributions, Barmatz has developed a method and system for performing dielectric property measurements at microwave frequencies. This patent details a sophisticated approach to obtaining the complex permittivity and permeability of samples within cavities by solving Maxwell's equations based on collected resonance frequencies. Additionally, he has made significant advances in the microwave bonding of MEMS components, where he utilizes high microwave absorbing films to achieve selective heating, optimizing the bonding process and minimizing energy loss.
Career Highlights: Barmatz has had a distinguished career working with prominent institutions such as the California Institute of Technology. He has also made significant contributions to his field while working for The United States of America as represented by the Administrator of the specific department.
Collaborations: Throughout his career, Martin B Barmatz has worked alongside esteemed colleagues, including Henry W Jackson and James L Allen. These collaborations highlight the importance of teamwork and shared innovation in advancing technological development.
Conclusion: Martin B Barmatz stands as a prominent figure in the realms of dielectric measurements and MEMS technology. His innovative patents and collaborations have made a lasting impact on the field, paving the way for further advancements and applications in various industries.