Location History:
- Ota-ku, JP (2010)
- Tokyo, JP (2017 - 2023)
Company Filing History:
Years Active: 2010-2025
Title: Innovations of Naruto Fuwa
Introduction
Naruto Fuwa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the development of innovative tools and manufacturing methods. With a total of 5 patents to his name, Fuwa continues to push the boundaries of engineering and design.
Latest Patents
One of Fuwa's latest inventions is a polishing tool designed for polishing wafers. This tool features a base and a polishing layer that is fixed to the base. The polishing layer incorporates an electrically conductive material to eliminate static electricity generated during contact with the wafer. Notably, carbon fiber is used as the conductive material, with a content ranging from 3 wt % to 15 wt %.
Another significant patent is the base-integrated blade manufacturing method. This method involves creating a base-integrated blade by fixing a cutting blade with a circular opening to a base that has an annular projection. The process includes several steps: preparing the base with a larger projection, lowering the temperature to shrink the base, inserting the projection into the cutting blade's opening, and finally raising the temperature to expand the base and secure the cutting blade.
Career Highlights
Naruto Fuwa is currently employed at Disco Corporation, where he applies his expertise in developing advanced manufacturing solutions. His work has been instrumental in enhancing the efficiency and effectiveness of various industrial processes.
Collaborations
Fuwa collaborates with talented coworkers, including Naoya Sukegawa and Shinnosuke Sekiya. Their combined efforts contribute to the innovative environment at Disco Corporation.
Conclusion
Naruto Fuwa's contributions to technology through his patents and work at Disco Corporation highlight his role as a leading inventor in Japan. His innovative spirit continues to inspire advancements in the field.