This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Toppan Forms Co., Ltd.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Nariaki Nawa: Innovator in Wiring Board Technology
Introduction
Nariaki Nawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wiring board technology. His innovative approach has led to the development of a unique method for producing wiring boards that enhances performance and efficiency.
Latest Patents
Nawa holds a patent for a "Method for producing wiring board." This invention features thin silver wires formed on a substrate using a printing method. The thin silver wires are designed with a cross-sectional width of 20 µm or less. Additionally, the top of the wires has a smaller width than the contact portion that interfaces with the substrate. The volume resistivity of the thin silver wire is 15 µΩ·cm or less, showcasing its advanced electrical properties.
Career Highlights
Nariaki Nawa is associated with Toppan Forms Co., Ltd., a company known for its innovative solutions in printing and electronic components. His work at Toppan Forms has positioned him as a key player in the development of cutting-edge wiring technologies.
Collaborations
Nawa collaborates with talented individuals such as Kumi Hirose and Takuya Sekiguchi. Their combined expertise fosters an environment of innovation and creativity within their projects.
Conclusion
Nariaki Nawa's contributions to wiring board technology exemplify the spirit of innovation. His patented methods and collaborative efforts continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile