The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jan. 08, 2018
Applicant:
Toppan Forms Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Toppan Forms Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); G06F 3/044 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01); H05K 1/0225 (2013.01); H05K 1/0274 (2013.01); H05K 3/1275 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/032 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09681 (2013.01);
Abstract
A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Hirose, Kumi. (2019). Method for producing wiring board (U.S. Patent No. 10477679). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10477679
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile