Kumi Hirose

Title: Kumi Hirose: Innovator in Wiring Board Technology

Introduction

Kumi Hirose is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wiring board technology, holding two patents that showcase his innovative approach to materials and methods.

Latest Patents

Hirose's latest patents include a method for producing a wiring board and a silver ink composition. The wiring board features thin silver wires formed on a substrate using a printing method. These wires have a cross-sectional width of 20 µm or less, with a top that is narrower than the contact portion that interfaces with the substrate. Additionally, the volume resistivity of the thin silver wire is 15 µΩ·cm or less. His silver ink composition consists of a silver carboxylate, an aliphatic primary or secondary amine, an acetylene alcohol, and a hydrocarbon, all formulated to achieve a viscosity of 40 mPa-s or less at 27°C.

Career Highlights

Kumi Hirose is currently employed at Toppan Forms Co., Ltd., where he continues to develop innovative solutions in wiring technology. His work has positioned him as a key figure in advancing the capabilities of wiring boards.

Collaborations

Hirose collaborates with talented coworkers, including Marina Imai and Takuya Sekiguchi, who contribute to his projects and enhance the innovative environment at Toppan Forms Co., Ltd.

Conclusion

Kumi Hirose's contributions to wiring board technology through his patents reflect his commitment to innovation and excellence in his field. His work continues to influence advancements in materials and methods used in electronics.