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For the Inventor, By the Inventor

Canton, MI, United States of America

Naoya Take

USPTO Granted Patents = 14

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 51(Granted Patents)


Company Filing History:

goldMedal14 out of 4,138 
 
Toyota Motor Engineering & Manufacturing North America, Inc.
 patents
silverMedal1 out of 2,345 
 
University of Illinois
 patents
where one patent can have more than one assignee

Years Active: 2019-2021

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14 patents (USPTO):Explore Patents
1. 11121061 - Cooling chip structures having a jet impingement system and assembly having the same (2021-09-14),
2. 11101193 - Power electronics modules including integrated jet cooling (2021-08-24),
3. 10903186 - Power electronic assemblies with solder layer and exterior coating, and methods of forming the same (2021-01-26),
4. 10896865 - Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate (2021-01-19),
5. 10879209 - Encapsulated stress mitigation layer and power electronic assemblies incorporating the same (2020-12-29),
6. 10861816 - Electronic assemblies having a mesh bond material and methods of forming thereof (2020-12-08),
7. 10830544 - Self-healing metal structures (2020-11-10),
8. 10818576 - Methods of forming power electronic assemblies using metal inverse opals and cap structures (2020-10-27),
9. 10804236 - Power electronic assemblies with high purity aluminum plated substrates (2020-10-13),
10. 10743442 - Cooling devices including jet cooling with an intermediate mesh and methods for using the same (2020-08-11),
11. 10700036 - Encapsulated stress mitigation layer and power electronic assemblies incorporating the same (2020-06-30),
12. 10515871 - Cooling devices having large surface area structures, systems incorporating the same, and methods of forming the same (2019-12-24),
13. 10505106 - Encapsulated PCM switching devices and methods of forming the same (2019-12-10),
14. 10490482 - Cooling devices including jet cooling with an intermediate mesh and methods for using the same (2019-11-26),

Title: Naoya Take: Innovator in Cooling Technologies

Introduction

Naoya Take is a prominent inventor based in Canton, MI (US), known for his contributions to cooling technologies in electronics. With a total of 14 patents to his name, he has made significant advancements in the field of semiconductor cooling systems.

Latest Patents

One of his latest patents is titled "Cooling chip structures having a jet impingement system and assembly having the same." This invention relates to an electronics assembly that includes a semiconductor device, a substrate layer, and two mesh layers. The design features jet channels within the substrate layer, allowing a cooling fluid to impinge on the semiconductor device's surface, enhancing cooling efficiency. Another notable patent is "Power electronics modules including integrated jet cooling." This module comprises an electrically-conductive substrate with orifices that create jet paths, improving the cooling of power electronics devices.

Career Highlights

Naoya Take has worked with notable organizations such as Toyota Motor Engineering & Manufacturing North America, Inc. and the University of Illinois. His experience in these institutions has contributed to his expertise in developing innovative cooling solutions for electronic devices.

Collaborations

Throughout his career, Naoya has collaborated with talented individuals, including Shailesh N Joshi and Ercan Mehmet Dede. These collaborations have further enriched his work and led to advancements in cooling technologies.

Conclusion

Naoya Take's innovative work in cooling technologies has made a significant impact on the electronics industry. His patents reflect a commitment to enhancing the efficiency and performance of semiconductor devices.

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