Fukui, Japan

Naoya Fujii

This inventor holds 1 USPTO granted patent. Top assignee: Nihon University. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoya Fujii. Retrieved from https://idiyas.com/inventor/naoya-fujii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Naoya Fujii: Innovator in Substrate Joining Methods

Introduction

Naoya Fujii is a notable inventor based in Fukui, Japan. He has made significant contributions to the field of joining methods, particularly through his innovative patent related to substrate joining techniques. His work is recognized for its practical applications in various industries.

Latest Patents

Naoya Fujii holds a patent for a "Substrate joining method using rivet, and joining structure." This method involves a unique process where laminated plate materials are joined using a rivet shaft portion of a Self-Piercing Rivet (SPR). The process includes punching the laminated materials, forming a crimp portion at the rivet's front end, and ensuring a secure fastening between the rivet head and the crimp portion. Additionally, washers are utilized as jigs during the punching process, enhancing the efficiency and effectiveness of the joining method.

Career Highlights

Fujii is affiliated with Nihon University, where he continues to engage in research and development in the field of materials joining. His academic background and practical experience contribute to his innovative approach to solving complex engineering challenges.

Collaborations

Naoya Fujii collaborates with Masahito Ueda, a fellow researcher, to further explore advancements in substrate joining technologies. Their partnership exemplifies the importance of teamwork in driving innovation.

Conclusion

Naoya Fujii's contributions to substrate joining methods highlight his role as a key innovator in the field. His patent reflects a commitment to advancing technology and improving industrial processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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