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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9555466 B1

PDFFull Text
Expired
Date of Patent:
Jan. 31, 2017

Filed:

Mar. 01, 2012

Substrate joining method using rivet, and joining structure

Applicants:

Masahito Ueda, Tokyo, JP;

Hiroyuki Hasegawa, Fukui, JP;

Kinya Watanabe, Fukui, JP;

Naoya Fujii, Fukui, JP;

Inventors:

Masahito Ueda, Tokyo, JP;

Hiroyuki Hasegawa, Fukui, JP;

Kinya Watanabe, Fukui, JP;

Naoya Fujii, Fukui, JP;

Assignee:

NIHON UNIVERSITY, Tokyo, JP;

Attorney:

Norris McLaughlin & Marcus, P.A.

Primary Examiner:

Christopher M Koehler

Int. Cl.
CPC ...
B21J 15/02 (2006.01); F16B 19/08 (2006.01); B29C 65/56 (2006.01); B29C 65/60 (2006.01); B29C 65/74 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); F16B 5/04 (2006.01);
U.S. Cl.
CPC ...
B21J 15/02 (2013.01); B21J 15/025 (2013.01); B29C 65/562 (2013.01); B29C 65/602 (2013.01); B29C 65/7437 (2013.01); B29C 65/8253 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/43 (2013.01); B29C 66/721 (2013.01); B29C 66/7212 (2013.01); B29C 66/81422 (2013.01); B29C 66/81423 (2013.01); B29C 66/81429 (2013.01); B29C 66/8322 (2013.01); F16B 19/08 (2013.01); F16B 19/086 (2013.01); B29C 66/72143 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); F16B 5/04 (2013.01); Y10T 29/49956 (2015.01);
Abstract

A joining method includes punching respective laminated plate materials by a rivet shaft portion of a SPR, forming a crimp portion at the front end of the rivet shaft portion, and fastening and joining the laminated plate materials between the rivet head portion and the crimp portion. Washers are laid on and brought into contact with respective opposite surfaces relative to joining surfaces of the laminated plate materials, the washers each having an inner hole through which the rivet shaft portion is allowed to pass, the washers are used as jigs at the time of the punching, the punching by means of the rivet shaft portion is performed along the inner holes of the washers, and the joining is performed so that the washers left between the rivet head and the crimp portion and the opposite surfaces.

Find Patent Forward Citations

Ueda, Masahito. (2017). Substrate joining method using rivet, and joining structure (U.S. Patent No. 9555466). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9555466

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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