Location History:
- Kanagawa-ken, JP (1999 - 2001)
- Mie-ken, JP (2012)
Company Filing History:
Years Active: 1999-2012
Title: Naoto Takebe - Innovator in Semiconductor Technology
Introduction
Naoto Takebe is an inventor based in Yokkaichi-shi, Japan. He has made significant contributions to the field of semiconductor technology. Although he currently holds no granted patents, his work in developing innovative semiconductor devices is noteworthy.
Latest Patent Applications
Naoto Takebe's latest patent applications include a semiconductor device that features a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. In this design, the electrode is placed on the first semiconductor chip and contains aluminum. The first connection member electrically connects the electrode and the substrate, utilizing gold or copper. The first sealing member is responsible for sealing the first semiconductor chip and the first connection member. Additionally, one or more second semiconductor chips are stacked on the first sealing member, with a second sealing member that encapsulates the first connection member, the second semiconductor chips, and the second connection members. A critical aspect of this invention is that the ratio of the total weight of chlorine ions and bromine ions in the first sealing member to the weight of the resins of the substrate and the first sealing member is maintained at 7.5 ppm or lower.
Another application by Takebe involves a semiconductor device and its manufacturing method, along with a semiconductor module that utilizes this technology. This device includes a wiring board with a semiconductor chip mounted on its first surface. It features first external electrodes on the same surface and second external electrodes on the opposite side. A sealing resin layer encapsulates the semiconductor chip and the first external electrodes, with a recessed portion that exposes part of each first external electrode. Multiple semiconductor devices can be stacked to create a semiconductor module with a package-on-package (POP) structure, allowing for electrical connections between the lower-side and upper-side devices.
Conclusion
Naoto Takebe's innovative approaches to semiconductor devices highlight his potential impact on the industry. His latest patent applications reflect a commitment to advancing technology in this field.