The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1999
Filed:
Jan. 14, 1997
Applicant:
Inventor:
Naoto Takebe, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257787 ; 257780 ; 257782 ; 257784 ;
Abstract
One end of bonding wires made of aluminium, gold, etc., is connected to a plurality of electrode pads formed on the main surface of a semiconductor chip. The other end of these bonding wires is exposed on the surface of the molded resin unit. Connecting electrodes made of aluminium are formed on top of the exposed parts of these bonding wires. The semiconductor chip and external circuitry are connected electrically by means of these connecting electrodes.