The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2012

Filed:

Mar. 21, 2011
Applicants:

Yuichi Sano, Mie-ken, JP;

Takashi Imoto, Mie-ken, JP;

Naoto Takebe, Mie-ken, JP;

Katsuhiro Ishida, Mie-ken, JP;

Tomomi Honda, Mie-ken, JP;

Yasushi Kumagai, Kanagawa-ken, JP;

Inventors:

Yuichi Sano, Mie-ken, JP;

Takashi Imoto, Mie-ken, JP;

Naoto Takebe, Mie-ken, JP;

Katsuhiro Ishida, Mie-ken, JP;

Tomomi Honda, Mie-ken, JP;

Yasushi Kumagai, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.


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