Ichihara, Japan

Naoko Tomoda


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: **Innovative Contributions of Naoko Tomoda in Semiconductor Technology**

Introduction

Naoko Tomoda, an accomplished inventor based in Ichihara, Japan, has made significant strides in the field of semiconductor technology. Her innovative work has led to the development of cutting-edge materials that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Naoko holds a notable patent for a "Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device." This invention aims to provide an adhesion film capable of bonding semiconductor chips to lead frames at a lower temperature than traditional polyimide resins. Notably, her invention avoids the generation of voids, which can adversely affect device performance. The thermoplastic resin composition includes specific amine components and is designed to improve the adhesion process while also serving as protection for lead frame-exposed areas.

Career Highlights

Naoko Tomoda is currently associated with Hitachi Chemical Company, Ltd., where she applies her expertise in polymer science and materials engineering to advance semiconductor technologies. Her work not only reflects her technical acumen but also her commitment to improving manufacturing processes that are crucial for the electronics industry.

Collaborations

Throughout her career, Naoko has collaborated with notable colleagues, including Kiyohide Tateoka and Toshiyasu Kawai. These partnerships have fostered innovative ideas and facilitated the successful execution of projects aimed at enhancing semiconductor applications.

Conclusion

In summary, Naoko Tomoda's contributions to semiconductor technology underscore her position as a leading inventor in her field. Her patent exemplifies the intersection of innovation and practicality, providing solutions that address key challenges in semiconductor manufacturing. With her continued efforts and collaborations, she is poised to influence the future landscape of electronic devices significantly.

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