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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7843045 B1

PDFFull Text
Date of Patent:
Nov. 30, 2010

Filed:

Jul. 18, 2006

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

Applicants:

Kiyohide Tateoka, Kimitsu, JP;

Toshiyasu Kawai, Chiba, JP;

Yoshiyuki Tanabe, Ichihara, JP;

Tomohiro Nagoya, Chiba, JP;

Naoko Tomoda, Ichihara, JP;

Inventors:

Kiyohide Tateoka, Kimitsu, JP;

Toshiyasu Kawai, Chiba, JP;

Yoshiyuki Tanabe, Ichihara, JP;

Tomohiro Nagoya, Chiba, JP;

Naoko Tomoda, Ichihara, JP;

Assignee:

Hitachi Chemical Co., Ltd., Tokyo, JP;

Attorney:

Antonelli, Terry, Stout & Kraus, LLP.

Primary Examiner:

Randy Gulakowski

Assistant Examiner:

Rachel Kahn

Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08G 73/14 (2006.01); C08G 69/26 (2006.01); C08G 69/40 (2006.01); C09J 7/02 (2006.01); C09J 177/06 (2006.01); C09J 177/10 (2006.01); C09J 179/08 (2006.01); H01L 23/48 (2006.01); H01L 21/02 (2006.01); B32B 15/088 (2006.01);
U.S. Cl.
CPC ...
Abstract

The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3'-(3″-aminophenoxy)phenyl)amino-1-(3′-(3″-aminophenoxy)phenoxy)benzene and 3,3′-bis(3″-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion film and a semiconductor device using the same.

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