Kimitsu, Japan

Kiyohide Tateoka

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kiyohide Tateoka. Retrieved from https://idiyas.com/inventor/kiyohide-tateoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Kiyohide Tateoka: Innovator in Semiconductor Technology

Introduction

Kiyohide Tateoka is a notable inventor based in Kimitsu, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent work. His expertise and dedication to advancing technology have positioned him as a key figure in his industry.

Latest Patents

Kiyohide Tateoka holds a patent for a thermoplastic resin composition for semiconductors, which includes an adhesion film, lead frame, and semiconductor device utilizing this composition. The objective of his invention is to provide an adhesion film that can bond a semiconductor chip to a lead frame at lower temperatures than traditional polyimide resin films, while also preventing void formation. This invention enhances the reliability and efficiency of semiconductor devices.

Career Highlights

Kiyohide Tateoka is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in developing advanced materials for semiconductor applications. His work has led to innovations that improve the performance and durability of semiconductor devices.

Collaborations

Throughout his career, Kiyohide Tateoka has collaborated with esteemed colleagues such as Toshiyasu Kawai and Yoshiyuki Tanabe. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Kiyohide Tateoka's contributions to semiconductor technology through his patent work exemplify his commitment to innovation. His advancements in adhesion films and thermoplastic resin compositions are paving the way for more efficient semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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