Kyoto, Japan

Naoki Takada

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Towa Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoki Takada. Retrieved from https://idiyas.com/inventor/naoki-takada-8mrg2grl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Naoki Takada: Resin Supply and Molding Innovation

Introduction

Naoki Takada is an inventor associated with Kyoto, Japan, and Towa Corporation. His listed patent concerns resin delivery and molding technology. The available information identifies 1 patent associated with him.

Latest Patents

Takada’s listed patent is “Resin Supply Device, Resin Molding Apparatus, and Method for Producing Resin Molded Product.” It describes a device that holds and supplies resin through an elastic nozzle. A clamp presses the nozzle tip from the outside, shaping its outlet into a rotationally symmetrical form with three or more folds and adjusting the outlet’s opening area. The patent also addresses resin molding equipment and a method for producing molded resin products.

Career Highlights

The patent connects Takada’s inventive work with resin supply and molding processes. Its design focuses on controlling the nozzle opening, which can help regulate how resin is dispensed during production. The provided information lists Towa Corporation as his company.

Collaborations

The available details associate Takada’s patent work with Towa Corporation. No additional collaborators or co-inventors are identified in the information provided.

Conclusion

Naoki Takada’s listed invention addresses adjustable resin delivery for molding applications, reflecting a focused contribution to manufacturing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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