Tokyo, Japan

Naoki Mihara

This inventor holds 1 USPTO granted patent. Top assignee: Ebara Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoki Mihara. Retrieved from https://idiyas.com/inventor/naoki-mihara-cgr8xxg1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Naoki Mihara: Innovator in Electrolytic Processing Technology

Introduction

Naoki Mihara is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of electrolytic processing technology. His innovative approach has led to advancements that enhance the uniformity of film thickness in plated films.

Latest Patents

Mihara holds a patent for an electrolytic processing apparatus and substrate processing method. This invention aims to improve the in-plane uniformity of film thickness by creating a more uniform electric field distribution across the substrate's surface. The apparatus includes a substrate holder, electrodes, a high resistance structure, and an electrolytic solution introducing portion, all designed to optimize the processing of large-area substrates.

Career Highlights

Naoki Mihara is associated with Ebara Corporation, a leading company in the field of fluid machinery and environmental engineering. His work at Ebara has been instrumental in developing technologies that address complex processing challenges in various industries.

Collaborations

Mihara has collaborated with notable colleagues, including Hidenao Suzuki and Kazufumi Nomura. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Naoki Mihara's innovative work in electrolytic processing technology exemplifies the impact of dedicated inventors in advancing industrial applications. His contributions continue to shape the future of substrate processing methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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