Company Filing History:
Years Active: 2017-2020
Title: Naohito Ishiguro: Innovator in Printed Wiring Board Technology
Introduction
Naohito Ishiguro is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology. With a total of 2 patents to his name, Ishiguro continues to push the boundaries of innovation in electronics.
Latest Patents
Ishiguro's latest patents include a printed wiring board that features a core substrate, a first build-up layer, and a second build-up layer. Each build-up layer consists of a first insulating layer with reinforcing material and a second resin insulating layer without reinforcing material. The design ensures that the top diameter of the first via conductor is substantially equal to that of the second via conductor, while the bottom diameter of the first via conductor is smaller than that of the second. Additionally, the conductor layers on both insulating layers include metal foils, seed layers, and electrolytic plating films.
Another notable patent is a wiring board with a built-in electronic component. This invention includes a core substrate that houses an electronic component, along with upper-layer structures on both surfaces of the substrate. The design incorporates via conductors that connect to the component's electrode, ensuring efficient functionality. The substrate features an accommodating layer with inner wiring and insulation layers, designed to house the electronic component securely.
Career Highlights
Naohito Ishiguro is currently associated with Ibiden Company Limited, where he applies his expertise in developing advanced wiring technologies. His work has been instrumental in enhancing the performance and reliability of electronic components.
Collaborations
Ishiguro has collaborated with notable colleagues such as Yasushi Inagaki and Takamitsu Hattori. Their combined efforts have contributed to the advancement of innovative technologies in the electronics sector.
Conclusion
Naohito Ishiguro stands out as a key figure in the field of printed wiring board technology. His innovative patents and collaborations reflect his commitment to advancing electronic design and functionality.