La Crosse, WI, United States of America

Nancy M W Androff

This inventor holds 1 USPTO granted patent. Top assignee: Isola Laminate Systems Corporation. Active years: 2001.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Nancy M W Androff

Introduction

Nancy M W Androff is a notable inventor based in La Crosse, WI (US). He has made significant contributions to the field of electrical substrates, particularly through his innovative patent. With a focus on high-density printed circuit substrates, Androff's work has implications for various electronic applications.

Latest Patents

Androff holds a patent for a "High density printed circuit substrate and method of fabrication." This invention presents a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer with a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer consists of a laminate that includes a cloth with a uniform weave and a resin that is consistently impregnated within the weave. Additionally, a removable layer may be attached to the laminate and removed prior to the metallizing of the first conductive layer. Various embodiments of this invention are described in detail.

Career Highlights

Androff is associated with Isola Laminate Systems Corporation, where he has contributed to advancements in laminate technology. His work has been instrumental in enhancing the performance and reliability of printed circuit boards.

Collaborations

Throughout his career, Androff has collaborated with notable colleagues, including Richard J Pommer and Jeffrey T Gotro. These collaborations have fostered innovation and development in the field of electrical substrates.

Conclusion

Nancy M W Androff's contributions to the field of electrical substrates through his patent demonstrate his commitment to innovation. His work continues to influence the development of high-density printed circuit technologies.

Profile summary based on public USPTO records.
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