The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2001

Filed:

Jul. 28, 1998
Applicant:
Inventors:

Richard J. Pommer, Trabuco Canyon, CA (US);

Jeffrey T. Gotro, Onalaska, WI (US);

Nancy M. W. Androff, La Crosse, WI (US);

Marc D. Hein, Onalaska, WI (US);

Corey J. Zarecki, Onalaska, WI (US);

Assignee:

Isola Laminate Systems Corp., LaCrosse, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ;
Abstract

The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.


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Pommer, Richard. (2001). High density printed circuit substrate and method of fabrication (U.S. Patent No. 6242078). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6242078

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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