Nam-Yong Oh

Title: The Innovations of Nam-Yong Oh

Introduction

Nam-Yong Oh is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing semiconductor packaging and improving methods for solder ball attachment.

Latest Patents

Nam-Yong Oh's latest patents include a semiconductor packaging device and methods related to solder ball attachment and memory module repair. The semiconductor packaging device features semiconductor package groups, a side retainer wall, and a filling layer located on a base plate. The design ensures that the side retainer wall surrounds the semiconductor package groups, while the filling layer is positioned between the wall and the packages. In his method of attaching a solder ball, a first material is coated on the solder ball, and a second material is applied to a substrate pad. These materials exothermically react upon contact, generating heat that adheres the solder ball to the pad.

Career Highlights

Nam-Yong Oh is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

He collaborates with talented coworkers, including Seong-Chan Han and Dong-Woo Shin, who contribute to the innovative environment at Samsung Electronics.

Conclusion

Nam-Yong Oh's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to improving electronic components, which is vital for the advancement of modern technology.