Samsung Electronics Co., Ltd.

Nam-Yong Oh

Seong-Chan Han

Dong-Woo Shin

Hyun-Jong Oh

Jae-Young Kim

Jae-Hoon Choi

Sun-Kyu Hwang

A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Semiconductor packaging device

In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Method of attaching a solder ball and method of repairing a memory module

A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Growing community of inventors

Cheonan-si, South Korea

Nam-Yong Oh