Company Filing History:
Years Active: 2006-2012
Title: Innovations by Nam Yin Leng
Introduction
Nam Yin Leng is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He holds a total of 3 patents that focus on advanced conductive systems and devices. His work has significantly impacted the efficiency and effectiveness of semiconductor die assemblies.
Latest Patents
Nam Yin Leng's latest patents include innovative methods and apparatus for eliminating wire sweep and shorting while avoiding the use of under-bump metallization. One of his key inventions involves an anisotropically conductive (z-axis) conductive layer in the form of a film or tape. This layer is applied to the active surface of a die and serves as a base for conductive redistribution bumps. These bumps are bonded to the ends of conductive columns and wire bonded to the bond pads of the die. The packages formed can be connected to substrates using additional wire bonds or by flip-chip bonding. The methods he developed can be performed at the wafer level, allowing for the efficient formation of semiconductor die assemblies.
Career Highlights
Nam Yin Leng is currently employed at Micron Technology Incorporated, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor substrates, particularly in I/O redistribution using wire bonds and anisotropically conductive film.
Collaborations
Nam collaborates with Edmund Koon Tian Lua, contributing to the development of cutting-edge technologies in their field.
Conclusion
Nam Yin Leng's innovative patents and contributions to semiconductor technology highlight his role as a significant inventor in the industry. His work continues to influence advancements in conductive systems and devices.
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