Tao Yuan Shien, Taiwan

Nakano Liu


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Nakano Liu: Innovator in Electroless Plating Technology

Introduction

Nakano Liu is a prominent inventor based in Tao Yuan Shien, Taiwan. He has made significant contributions to the field of semiconductor manufacturing through his innovative work in electroless plating technology. His expertise and dedication have led to the development of a unique apparatus that enhances the plating process for semiconductor wafers.

Latest Patents

Nakano Liu holds a patent for an electroless plating apparatus and method. This invention is specifically designed for plating at least one semiconductor wafer. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is equipped with at least one inlet for containing the electrolyte. The wafer holder is positioned within the container, while the electrolyte supplying unit is responsible for delivering the electrolyte into the container through the inlet. The ultrasonic-vibration unit, which includes at least one frequency ultrasonic transducer, is installed in the container to create a uniform flow of electrolyte. This innovative design allows for uniform plating of wafers, particularly those with fine via-holes or trench structures.

Career Highlights

Nakano Liu has established himself as a key figure in the semiconductor industry. His work at Win Semiconductors Corp. has been instrumental in advancing electroless plating techniques. His patent reflects his commitment to improving manufacturing processes and ensuring high-quality results in semiconductor production.

Collaborations

Nakano Liu collaborates with talented professionals in his field, including Jason Chen and Winson Shao. These partnerships enhance the innovation and effectiveness of the projects they undertake together.

Conclusion

Nakano Liu's contributions to electroless plating technology have made a significant impact on the semiconductor industry. His innovative patent demonstrates his expertise and commitment to advancing manufacturing processes. His work continues to influence the field and inspire future innovations.

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