Meylan, France

Nadia Miloud-Ali



 

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Meylan, FR (2014 - 2017)
  • Grenoble, FR (2023)

Company Filing History:


Years Active: 2014-2023

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4 patents (USPTO):Explore Patents

Title: Nadia Miloud-Ali: Innovator in Soldering and Joining Technologies

Introduction

Nadia Miloud-Ali is a prominent inventor based in Meylan, France. She has made significant contributions to the field of soldering and joining technologies, holding a total of 4 patents. Her innovative methods have advanced the way components are assembled, particularly in the context of electronics and materials science.

Latest Patents

One of her latest patents is a method for assembling components that implements a pre-treatment of solder bumps, allowing for assembly through fluxless and residue-free soldering. This method involves pre-treating the first and second components with a liquid that removes the oxide layer on the solder, enabling a cleaner assembly process. Another notable patent focuses on compositions for joining and assembling parts made of silicon carbide-based materials. This method utilizes non-reactive brazing to create durable joints, enhancing the reliability of silicon carbide components in various applications.

Career Highlights

Throughout her career, Nadia has worked with esteemed organizations such as the Commissariat à l'Énergie Atomique et aux Énergies Alternatives and the Commissariat à l'Énergie Atomique. Her work in these institutions has allowed her to develop and refine her innovative techniques in soldering and joining technologies.

Collaborations

Nadia has collaborated with various professionals in her field, including her coworker Valérie Chaumat, who has also contributed to advancements in related technologies.

Conclusion

Nadia Miloud-Ali's contributions to soldering and joining technologies have positioned her as a key innovator in her field. Her patents reflect her commitment to advancing manufacturing processes and improving the quality of component assembly.

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