Nader Gamini

Title: Nader Gamini: Innovating with Laminated Interposers and Embedded Trace Interconnects

Introduction:

Nader Gamini, a seasoned inventor and engineer based in Cupertino, CA, has made significant contributions to the field of electronic packaging with his groundbreaking patents. With three patents to his name, Nader Gamini has cemented his place as an innovator in the development of laminated interposers and packages with embedded trace interconnects.

Nader Gamini's Latest Patents:

Nader Gamini's latest patents focus on achieving vertical conductive vias in packages and interposers by embedding conductive traces in laminated substrates. By depositing conductive traces on multiple wafers or panes and then laminating them into a stack, the traces become embedded. The laminated stack is then sliced to the desired dimensions of an interposer or electronic package. By utilizing a side of the sliced stack as the top of the interposer or package, some horizontally laid traces are transformed into vertical conductive vias. These interposers and packages can be further developed by adding redistribution layers, active and passive components, and even embedding electronic components within the laminated stack.

Companies and Collaborations:

Nader Gamini has contributed his expertise to notable companies within the industry. His professional journey includes collaborations with Invensas Corporation and OCCAM Portfolio LLC. Invensas Corporation, known for its cutting-edge advanced packaging solutions, has benefited from Nader Gamini's inventive mind, while his involvement with OCCAM Portfolio LLC has showcased his ability to drive innovation in the field of electronics.

Collaboration with Joseph Fjelstad:

In his pursuit of innovation, Nader Gamini has worked closely with Joseph Fjelstad, another respected figure in the electronics industry. Collaborations like these exemplify the effective team dynamics that drive technological advancements. Together, they have contributed to the evolution of laminated interposers and embedded trace interconnects, making significant strides in enhancing electronics packaging and connectivity.

Conclusion:

Nader Gamini's impressive portfolio of patents in the field of laminated interposers and embedded trace interconnects demonstrates his commitment to pushing the boundaries of electronics packaging technologies. With his inventive solutions and collaborations with industry experts, he has made a lasting impact on the field. The continued efforts of innovators like Nader Gamini pave the way for advancements in electronic packaging, opening up new possibilities for improved performance, miniaturization, and integrated functionality in our everyday electronic devices.