Penang, Malaysia

Myitzu Soe Myat

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Myitzu Soe Myat. Retrieved from https://idiyas.com/inventor/myitzu-soe-myat

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Myitzu Soe Myat: Innovator in Power Delivery Networks

Introduction

Myitzu Soe Myat is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of power delivery networks through his innovative patent. His work focuses on enhancing the efficiency and cost-effectiveness of power delivery systems.

Latest Patents

Myitzu holds a patent titled "Embedding thin film resistors in substrates in power delivery networks." This invention utilizes die side capacitors and embedded resistors to create a more advantageous power delivery network. The embedded resistors allow for more precise control, and by combining them with die side capacitors, the overall costs can be reduced. The embedded resistors can be integrated within the metallization layers, either at an upper or lower layer, providing flexibility in design.

Career Highlights

Myitzu Soe Myat is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in the advancement of power delivery systems.

Collaborations

Myitzu collaborates with talented colleagues, including Yongki Min and Eu Soon Lee. Their combined expertise contributes to the success of their projects and the advancement of technology in their field.

Conclusion

Myitzu Soe Myat is a pioneering inventor whose work in power delivery networks is making a significant impact. His innovative approach to embedding resistors in substrates showcases his commitment to improving technology and reducing costs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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