Muk Fung Yuen

Title: Muk Fung Yuen: Innovator in Electrospun Film Technology

Introduction

Muk Fung Yuen is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of materials science, particularly through his innovative work on electrospun films. His inventions focus on enhancing the properties of materials used in various applications.

Latest Patents

Muk Fung Yuen holds 1 patent for his invention titled "Electrospun film, method for manufacturing the same and use of such electrospun film." This invention provides an enhanced electrospun film made from polyvinylidene fluoride (PVDF) combined with at least one low-melting-point polymer. The ratio of these materials ranges from 99.9:0.1 to 90:10 by weight. The low-melting-point polymer has a melting point lower than that of PVDF and a softening point between 110-140° C. The resulting electrospun film exhibits excellent mechanical properties, higher moisture permeability, and hydrostatic pressure resistance. Additionally, the invention outlines a method for manufacturing this enhanced PVDF electrospun film and its application in creating waterproof and moisture-permeable products.

Career Highlights

Throughout his career, Muk Fung Yuen has worked with various organizations, including Nanodocks Technology Limited and City University of Hong Kong. His experience in these institutions has allowed him to develop and refine his innovative ideas in materials science.

Collaborations

Muk Fung Yuen has collaborated with Shuo Shi, contributing to the advancement of electrospun film technology.

Conclusion

Muk Fung Yuen's work in the field of electrospun films showcases his innovative spirit and dedication to improving material properties for practical applications. His contributions are significant in advancing technology in this area.