The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Aug. 30, 2022
Applicants:

Nanodocks Technology Limited, Hong Kong, CN;

City University of Hong Kong, Hong Kong, CN;

Inventors:

Jinlian Hu, Hong Kong, CN;

Shuo Shi, Hong Kong, CN;

Yifan Si, Hong Kong, CN;

Siu Wah Wong, Hong Kong, CN;

Muk Fung Yuen, Hong Kong, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); D01D 1/02 (2006.01); D01D 5/00 (2006.01); D01F 6/48 (2006.01); D01F 6/50 (2006.01); D04H 1/4318 (2012.01); D04H 1/728 (2012.01);
U.S. Cl.
CPC ...
D01D 5/0038 (2013.01); C08J 5/18 (2013.01); D01D 1/02 (2013.01); D01F 6/48 (2013.01); D01F 6/50 (2013.01); D04H 1/4318 (2013.01); D04H 1/728 (2013.01); C08J 2327/16 (2013.01); C08J 2429/14 (2013.01); D10B 2321/042 (2013.01); D10B 2321/06 (2013.01);
Abstract

The invention provides an enhanced electrospun film made from polyvinylidene fluoride (PVDF) and at least one low-melting-point polymer in a ratio of 99.9:0.1-90:10 by weight, and the low-melting-point polymer having a melting point lower than the polyvinylidene fluoride and a softening point in the range of 110-140° C. The enhanced electrospun film exhibits excellent mechanical properties, higher moisture permeability and hydrostatic pressure resistance. The invention further provides a method for manufacturing the enhanced PVDF electrospun film, and use of the enhanced PVDF electrospun film in preparing a waterproof and moisture permeable product.


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