Mu Wei Lee

Title: Innovations of Mu Wei Lee in Semiconductor Technology

Introduction

Mu Wei Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to semiconductor packages.

Latest Patents

Mu Wei Lee holds a patent for "Semiconductor packages with through via structures and methods for testing the same." This patent describes a semiconductor package that includes an array of through-substrate-via (TSV) structures. The array comprises a number of active TSV structures and contact structures that are configured to receive input test signals and provide output test signals. Additionally, the patent outlines a plurality of binary-tree branches that electrically couple various active TSV structures.

Career Highlights

Mu Wei Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing semiconductor packaging technologies, which are crucial for the performance and reliability of electronic devices.

Collaborations

Some of Mu Wei Lee's coworkers include Ying-Chih Hsu and Jui-Cheng Huang, who contribute to the collaborative efforts in their projects.

Conclusion

Mu Wei Lee's innovative work in semiconductor technology exemplifies the advancements being made in the industry. His patent reflects a commitment to improving the efficiency and functionality of semiconductor packages.