Taiwan Semiconductor Manufacturing Comp. Ltd.

Mu Wei Lee

Jui-Cheng Huang

Ying-Chih Hsu

Wei-Tao Shaw

A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures, wherein the array comprises a number (M) of active TSV structures; a number (N) of contact structures, the contact structures comprising a plurality of pairs configured to receive an input test signal and provide an output test signal, respectively; and a plurality of binary-tree branches, each of the plurality of binary-tree branches electrically coupling a first one of the active TSV structures to a second one of the active TSV structures and a third one of the active TSV structures.

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Hsinchu, Taiwan

Mu Wei Lee