Location History:
- Chu-Pei, TW (2000 - 2002)
- Hsin-Chu Hsien, TW (2001 - 2002)
- Hsinchu, TW (2006)
Company Filing History:
5 out of 293 
1 out of 1 Years Active: 2000-2006
Title: The Innovations of Mu-Sheng Liao
Introduction
Mu-Sheng Liao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor testing, holding a total of 6 patents. His work focuses on improving the efficiency and effectiveness of integrated circuit (IC) testing.
Latest Patents
One of Liao's latest patents is a load board designed for packaged IC testing. This load board features predetermined testing circuits and bonding pad areas on its surface. A plurality of bonding pads is formed on these areas, each corresponding to a lead of a packaged IC for testing connection. This innovation allows for direct connection of the leads during IC testing, eliminating the need for a conventional test socket. Another significant patent is a testing jig for semiconductor components. This jig comprises a main body with a retrieving head at the bottom. The retrieving head has a concave space surrounded by air holes connected to internal airways, facilitating efficient retrieval of the base board during testing.
Career Highlights
Liao has worked with prominent companies in the semiconductor industry, including Silicon Integrated Systems Corporation and Silicon Integrated Systems Company. His experience in these organizations has contributed to his expertise in IC testing technologies.
Collaborations
Some of Liao's notable coworkers include Lai-Fue Hsieh and Yi-Chang Hsieh, who have collaborated with him on various projects in the semiconductor field.
Conclusion
Mu-Sheng Liao's innovations in semiconductor testing have significantly advanced the industry. His patents reflect a commitment to enhancing testing processes and improving the reliability of integrated circuits.